Emspcba PCB Fabrication Capability
NoItemPCB Process Capability
1base materialNormal TG FR4, High TG FR4, PTFE, Rogers, Low Dk/Df etc.
2Solder mask colorgreen, red, blue, white, yellow, purple,black
3Legend colorwhite, yellow, black, red
4Surface treatment typeENIG, Immersion tin, HAF, HAF LF, OSP, flash gold, gold finger, sterling silver
5Max. layer-up(L)50
6Max. unit size (mm)620*813 (24″*32″)
7Max. working panel size (mm)620*900 (24″x35.4″)
8Max. board thickness (mm)12
9Min. board thickness(mm)0.3
10Board thickness tolerance (mm)T<1.0 mm: +/-0.10mm ;  T≥1.00mm: +/-10%
11Registration tolerance (mm)+/-0.10
12Min. mechanical drilling hole diameter (mm)0.15
13Min. laser drilling hole diameter(mm)0.075
14Max. aspect(through hole)15:1
 Max. aspect(micro-via)1.3:1
15Min. hole edge to copper space(mm)L≤10, 0.15;L=12-22,0.175;L=24-34, 0.2;L=36-44, 0.25;L>44, 0.3
16Min. Inner layer clearance(mm)0.15
17Min. hole edge to hole edge space(mm)0.28
18Min. hole edge to profile line space(mm)0.2
19Min. Inner layer copper to profile line space (mm)0.2
20Registration tolerance between holes (mm)±0.05
21Max. finished copper thickness(um)Outer Layer: 420   (12oz)
Inner Layer: 210   (6oz)
22Min. trace width (mm)0.075 (3mil)
23Min. trace space (mm)0.075 (3mil)
24Solder mask thickness (um)line corner :  >8 (0.3mil)
upon copper: >10 (0.4mil)
25ENIG golden thickness (um)0.025-0.125
26ENIG nickle thickness (um)3-9
27Sterling silver thickness (um)0.15-0.75
28Min. HAL tin thickness (um)0.75
29Immersion tin thickness (um)0.8-1.2
30Hard-thick gold plating gold thickness  (um)1.27-2.0
31golden finger plating gold thickness (um)0.025-1.51
32golden finger plating nickle thickness(um)3-15
33flash gold plating gold thickness (um)0,025-0.05
34flash gold plating nickle thickness  (um)3-15
35profile size tolerance (mm)±0.08
36Max. solder mask plugging hole size (mm)0.7
37BGA pad (mm)≥0.25 (HAL or HAL Free:0.35)
38V-CUT blade position tolerance (mm)+/-0.10
39V-CUT position tolerance (mm)+/-0.10
40Gold finger bevel angle tolerance (o)+/-5
41Impedance tolerance (%)+/-5%
42Warpage tolerance (%)0.75%
43Min. legend width  (mm)0.1
44Fire flame class94V-0
Special for Via in pad productsResin plugged hole size (min.) (mm)0.3
Resin plugged hole size (max.) (mm)0.75
Resin plugged board thickness (min.) (mm)0.5
Resin plugged board thickness (max.) (mm)3.5
Resin plugged maximum aspect ratio8:1
Resin plugged minimum hole to hole space (mm)0.4
Can difference hole size in one board?yes
 Max. panel size (finished) (mm)880 ×580
Max. working panel size (mm)914 × 602
Max. board thickness (mm)12
Max. layer-up(L)40
Aspect30:1 (Min. hole: 0.4 mm)
Line wide/space (mm)0.075/ 0.075
Back drill capabilityYes
Tolerance of back drill (mm)±0.05
Tolerance of  press fit holes (mm)±0.05
Surface treatment typeOSP, sterling silver, ENIG
Rigid-flex boardHole size (mm)0.2
Dielectrical thickness (mm)0.025
Working Panel size (mm)350 x 500
Line wide/space (mm)0.075/ 0.075
Flex board layers (L)8 (4plys of flex board)
Rigid board layers (L)≥14
Surface treatmentAll
Flex board in mid or outer layerBoth
Special for HDI productsLaser drilling hole size (mm)0.075
Max. dielectric thickness (mm)0.15
Min. dielectric thickness (mm)0.05
Max. aspect1.5:1
Bottom Pad size (under micro-via) (mm)Hole size+0.15
Top side Pad size ( on micro-via) (mm)Hole size+0.15
Copper filling or not (yes or no) (mm)yes
Via in Pad design or not ( yes or no)yes
Buried hole resin plugged (yes or no)yes
Min. via size can be copper filled (mm)0.1
Max. stack times4